Wevo-Chemie has introduced WEVOSIL 28015 FL, a new 2K RTV silicone adhesive designed to meet the evolving demands of battery modules and power electronics.
This addition-curing material offers a unique combination of thermal conductivity, structural strength and residual flexibility – key attributes for modern automotive and electronics applications.
With thermal conductivity rated at 1.5 W/m·K, WEVOSIL 28015 FL enables precise heat dissipation even under high power densities. Its wide operating temperature range – from −60°C to 200°C – ensures reliable performance in extreme conditions. Mechanical properties include Shore A 70 and a modulus of elasticity of 60N/mm², supporting robust structural bonding. Residual flexibility, with elongation at break between 20–25%, helps absorb stress and prevent cracking during thermal cycling.
Application is streamlined via its thixotropic nature, allowing bead dispensing from cartridges, hobbocks or drums. Suitable for CIPG and FIPG processes, the silicone adhesive integrates easily into automated production. Fast curing—achieving >2 MPa adhesion within minutes using IR or laser—further enhances throughput. The addition-curing system also prevents shrinkage and gap formation, ensuring reliable bonding in enclosed assemblies.
In EVs, the WEVOSIL 28015 FL silicone adhesive supports crash-safe, thermally resilient battery module integration. In power electronics, it replaces mechanically weak gap fillers, reducing the need for complex fastenings.
